[Coco] Grant Searles SBC

Zippster zippster278 at gmail.com
Wed May 6 22:15:26 EDT 2015

I would normally go with .1uF ceramics, 1 per IC, perhaps 2 on  the CPU.
1uF or slightly larger decoupling on the MAX232.

Are you using tantalum caps for the charge pumps on the MAX232?
Some versions can use ceramics as well.

- Ed

> On May 6, 2015, at 9:03 PM, Bill Nobel <b_nobel at hotmail.com> wrote:
> Yes I do. I am use 1uf caps right now, should I use maybe .1uf instead?
> Bill Nobel
>> On May 6, 2015, at 8:00 PM, Zippster <zippster278 at gmail.com> wrote:
>> I would think you would be ok as far as bleed over, although you could try separating them a bit.
>> Breadboarding always makes me wonder if I’m getting reliable contact with everything.
>> Do you have decoupling caps on all the chips, including the MAX232?
>> - Ed

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