[Coco] I've killed my CoCo3

[dwight.bazinet]

Hi Ed,

I used to have a full pace kit available to me n my work lab.  I much
prefered the vacuum desoldering tool (not the plunger, but the vacuum with
the solder filter).  I wouldn't even clip the pins, it would do that good a
job cleaning them up.  I used just a small amount of liquid flux prior to
heat, and then it would melt right away an hen vacuum, which also drew away
the flux.

However, I cn't afford a full Pace kit at home.  I haven't ot one of the
cheaper stations because I don't know how well they work, so I use a
plunger.  If I was going to do a lot of work I would get sone liquid flux.

Do you prefer braid over a proper vacuum tool?



On Oct 19, 2017 9:39 AM, "Zippster" <zippster278 at gmail.com> wrote:

> Hi Paul,
>
> I’m sorry it went that way.  I still consider the clip and and desoldering
> braid the safest way,
> but it is pretty important to have a soldering station where you can
> control the temp, and using
> a proper tip for the iron.  A ‘drag soldering’ type tip, basically a
> straight cylinder with the end cut
> at an angle is best (for applying heat to the braid), a chisel tip
> probably second best.  Having a
> flat surface at the tip allows for faster more accurate heat transfer to
> the pad and solder without
> excessively heating the board material.  I find the common round pencil
> style tips to be one of the least
> suitable for anything.  I use a chisel or drag type for everything.  Of
> course that’s just my opinion and
> everyone has their own way of doing things.
>
> All that said, it’s possible the board was degraded or just not up to par
> in some way which
> helped it fall apart on you.  It can happen.
>
> If you want, you can send the board to me, I’m certain I can patch it up
> for you.  No charge, just
> take care of the shipping.  Unless someone has a motherboard with a dead
> GIME out there.
>
> - Ed
>
>
> > On Oct 19, 2017, at 6:13 AM, Paul Shoemaker <paulfe3 at swbell.net> wrote:
> >
> > Hi everyone,
> >
> > Yesterday evening I decided to replace the 6809 with a 6309 in my CoCo
> 3.  Although I am still an amateur with a soldering iron, I've been
> practicing and recently completed this same process on one of my CoCo 2
> systems where I clipped out the 6809, desoldered the remaining pins, and
> soldered in a socket.  However, when I tried this same approach on my CoCo
> 3, as soon as I started using solder wick, I noticed some of the solder
> pads began to come off.  I don't think I was using excessive heat (same
> iron, same heat settings as before).  Even the traces on the board began to
> lift up.  It became clear to me after this happened to a few pads that I
> had destroyed the board.
> >
> > If anything I was more gentle with the CoCo 3 board than I was with the
> CoCo 2 board before.  It was evident that the CoCo3 board was more
> "weathered" than any of my other systems...  more dust and dirt inside, a
> lot of oxidation on the RF modulator box, etc.  It may be that this CoCo 3
> spent many years in a garage or shed prior to me rescuing it from eBay last
> year.
> >
> > Any advice on how to avoid from happening again this in the future?
> >
> > -Paul
> >
> >
> >
> >
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